The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 20, 2007
Filed:
Aug. 24, 2004
Satoshi Yamamoto, Tokyo, JP;
Tatsuo Suemasu, Tokyo, JP;
Sayaka Hirafune, Tokyo, JP;
Toshihiko Isokawa, Ina, JP;
Koichi Shiotani, Kamiina-gun, JP;
Kazuya Matsumoto, Kamiina-gun, JP;
Satoshi Yamamoto, Tokyo, JP;
Tatsuo Suemasu, Tokyo, JP;
Sayaka Hirafune, Tokyo, JP;
Toshihiko Isokawa, Ina, JP;
Koichi Shiotani, Kamiina-gun, JP;
Kazuya Matsumoto, Kamiina-gun, JP;
Fujikura Ltd., Tokyo, JP;
Olympus Corporation, Tokyo, JP;
Abstract
A semiconductor package of the invention comprises: a semiconductor element provided with a circuit element on one surface of a semiconductor substrate; an external wiring region provided on an other surface of the semiconductor substrate; a support substrate disposed on the one surface of the semiconductor substrate; an electrode pad disposed on the one surface of the semiconductor substrate; and a through-electrode which extends from the electrode pad through to the other surface of the semiconductor substrate.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile