Taipei, Taiwan

Saurav Verma

This inventor holds 1 USPTO granted patent. Top assignee: National Taiwan University of Science and Technology. Active years: 2022.


% Patents Active = 100.0

Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2022

Loading Chart...
1 patent (USPTO):Explore Patents

Title: Saurav Verma: Innovator in Additive Manufacturing

Introduction: Saurav Verma is a prominent inventor based in Taipei, Taiwan. He has made significant contributions to the field of additive manufacturing, particularly in the area of post-processing techniques. His innovative approach aims to streamline the manufacturing process, making it more efficient and effective.

Latest Patents: Saurav Verma holds a patent for a "Ventilated three-dimensional structure from additive manufacture for easy powder removal during post process." This invention addresses the challenges associated with the lengthy and complex process of removing unused powder or resin after printing. The lattice structure he designed simplifies this task by allowing air to be blown through the additive manufacturing parts, facilitating easier removal of excess materials.

Career Highlights: Saurav Verma is affiliated with the National Taiwan University of Science and Technology, where he continues to advance his research and development in additive manufacturing. His work has garnered attention for its practical applications and potential to improve manufacturing efficiency.

Collaborations: Some of his notable coworkers include Ajeet Kumar and Jeng-Ywan Jeng, who contribute to the collaborative efforts in their research projects.

Conclusion: Saurav Verma's innovative contributions to additive manufacturing exemplify the potential for advancements in technology to enhance production processes. His patent reflects a significant step forward in simplifying post-processing tasks, showcasing his commitment to innovation in the field.

Profile summary based on public USPTO records.
Please report any incorrect information to [email protected]
Loading…