Amherst, NY, United States of America

Saurabh Khuje

This inventor holds 1 USPTO granted patent and 2 published patent applications. Top assignee: The State University of New York. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Saurabh Khuje. Retrieved from https://idiyas.com/inventor/saurabh-khuje

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 1 

% Patents Active = 100.0

Average Co-Inventor Count = 3.0

ph-index = 1


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Saurabh Khuje: Innovator in High-Temperature Conductive Inks

Introduction

Saurabh Khuje is an accomplished inventor based in Amherst, NY (US). He has made significant contributions to the field of conductive materials, particularly through his innovative patent related to high-temperature conductive inks.

Latest Patents

Saurabh Khuje holds a patent for a high-temperature Cu ink-based conductor with oxidation and corrosion resistance. This patent provides conductive slurries that incorporate copper nanoplates, which may be functionalized with formate groups and/or graphene or a graphene material. The slurries can be utilized as conductive inks, making them suitable for various 3D printing applications. Additionally, the patent outlines methods for making and using these conductive slurries.

Career Highlights

Saurabh Khuje is affiliated with the State University of New York, where he continues to advance research in conductive materials. His work has garnered attention for its potential applications in modern manufacturing and technology.

Collaborations

Saurabh has collaborated with notable colleagues, including Shenqiang Ren and Aaron Sheng, contributing to a dynamic research environment that fosters innovation.

Conclusion

Saurabh Khuje's work in high-temperature conductive inks exemplifies the intersection of innovation and practical application in modern technology. His contributions are paving the way for advancements in 3D printing and conductive materials.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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