Tokyo, Japan

Satoru Serizawa

This inventor holds 1 USPTO granted patent. Top assignee: Hitachi, Ltd.. Active years: 2021.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Satoru Serizawa. Retrieved from https://idiyas.com/inventor/satoru-serizawa-kk99o2bm

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

Average Co-Inventor Count = 4.0

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2021

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1 patent (USPTO):Explore Patents

Title: Satoru Serizawa: Innovator in Unpacking Technology

Introduction

Satoru Serizawa is a notable inventor based in Tokyo, Japan. He has made significant contributions to the field of unpacking technology, showcasing his innovative spirit through his patented inventions.

Latest Patents

One of his key patents is an unpacking system and unpacking method. This system is designed to efficiently unpack a box with flaps. It includes an unsealing unit that cuts a proximity region where flaps facing each other in a closed state come close together. Additionally, it features a lid-opening unit that opens a predetermined flap at an angle exceeding 90 degrees, and a flap cutting unit that cuts along the side surface of the box.

Career Highlights

Satoru Serizawa is currently employed at Hitachi, Ltd., where he continues to develop innovative solutions in technology. His work has garnered attention for its practicality and efficiency in unpacking processes.

Collaborations

He has collaborated with notable coworkers, including Takaomi Nishigaito and Tsunamichi Tsukidate, contributing to advancements in their respective fields.

Conclusion

Satoru Serizawa's contributions to unpacking technology exemplify his innovative mindset and dedication to improving efficiency in everyday tasks. His work continues to influence the industry and inspire future inventions.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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