Sara T Joslin

Title: Sara T Joslin: Innovator in Die Attach Adhesive Composition

Introduction

Sara T Joslin is a prominent inventor based in Cherry Hill, NJ (US). She has made significant contributions to the field of adhesive compositions, particularly in the bonding of integrated circuits to substrates. Her innovative work has led to the development of a unique patent that addresses critical needs in the electronics industry.

Latest Patents

Sara holds a patent for a "Die attach adhesive composition." This composition is designed for bonding integrated circuits to inorganic dielectric substrates. It comprises an admixture of finely divided particles of a thermally conductive metal or metal-containing compound, non-aqueously milled amorphous glass frit, and a fatty acid-based surfactant. These components are dispersed in a solution of primary organic solvent selected from ethylene glycol monobutyl ether acetate, dimethyl adipate, and mixtures thereof. The formulation may also include minor amounts of certain secondary solvents and an acrylic polymer that is free of polar functional groups. This innovative adhesive composition enhances the reliability and performance of electronic devices.

Career Highlights

Sara T Joslin is currently employed at E.I. du Pont de Nemours and Company, where she continues to advance her research and development efforts. Her work at this esteemed company has allowed her to collaborate with other talented professionals in the field.

Collaborations

Some of her notable coworkers include Christine M Rosell and Jerome David Smith. Their collective expertise contributes to the innovative environment at E.I. du Pont de Nemours and Company.

Conclusion

Sara T Joslin's contributions to adhesive technology exemplify her commitment to innovation in the electronics industry. Her patent for die attach adhesive composition showcases her ability to address complex challenges in bonding materials. Through her work, she continues to make a significant impact in her field.