Sant Hongsongkiat

Title: The Innovations of Sant Hongsongkiat

Introduction

Sant Hongsongkiat is a notable inventor based in Bangkok, Thailand. He has made significant contributions to the field of semiconductor technology. With a total of 2 patents to his name, his work focuses on enhancing the performance and reliability of semiconductor packages.

Latest Patents

Hongsongkiat's latest patents include a semiconductor package with plated metal shielding and a method thereof. This invention involves methods of manufacturing semiconductor packages with metal-plated shields. The process includes roughening the surfaces of a molding compound through an abrasion process, resulting in an unnatural surface roughness that is rougher than a natural surface roughness. The method also entails obtaining a molded array with a plurality of dies coupled to a substrate and encapsulated by a molding compound. An adhesion promoter material is coated on all exposed surfaces, followed by heating the molded array to create a baked film. The baked film is then etched away, resulting in roughened surfaces that enhance adhesion for the metal-plated shield. Additionally, a catalyst material can be deposited on these roughened surfaces to expedite the adhesion of the metal layer.

Career Highlights

Hongsongkiat is currently employed at Utac Headquarters Pte. Ltd., where he continues to innovate in semiconductor technology. His work has been instrumental in advancing the capabilities of semiconductor packages, making them more efficient and reliable.

Collaborations

He collaborates with talented coworkers such as Suebphong Yenrudee and Chanapat Kongpoung. Their combined expertise contributes to the success of their projects and innovations.

Conclusion

Sant Hongsongkiat's contributions to semiconductor technology through his patents demonstrate his commitment to innovation. His work not only enhances the performance of semiconductor packages but also sets a foundation for future advancements in the field.