Suwon, South Korea

Sangyong Lee

This inventor holds 2 USPTO granted patents and 3 published patent applications. Top assignee: Samsung Electronics Ltd.. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Sangyong Lee. Retrieved from https://idiyas.com/inventor/sangyong-lee-ilve216q

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 2 

Average Co-Inventor Count = 8.0

ph-index = 1


Company Filing History:


Years Active: 2026

Loading Chart...
2 patents (USPTO):Explore Patents

Title: Sangyong Lee: Semiconductor Transport Innovation.

Introduction

Sangyong Lee is an inventor based in Suwon, South Korea, and is associated with Samsung Electronics Ltd. His patent work addresses the packaging and controlled transport of semiconductor wafers.

Latest Patents

Lee is credited with 1 patent: “Semiconductor Transport System and Method of Transporting Semiconductor.” The invention describes packaging a wafer-containing accommodation container first with vinyl and then with a logistics bag. It is then held in a standby chamber before being moved by a transporter. The chamber is maintained at 18°C to 23.5°C, with humidity kept between 0% and 45%.

Career Highlights

Lee’s listed patent focuses on managing environmental conditions and packaging during semiconductor transport. This approach is intended to support the handling of wafers as they move through packaging, standby, and transport stages.

Collaborations

Lee’s listed coworkers include Minseock Chang and Kunho Kwak. The available information identifies them as colleagues but does not specify their roles in the patent.

Conclusion

Sangyong Lee’s recorded invention concerns a controlled packaging and transport process for semiconductor wafers, reflecting a practical focus on handling conditions throughout transit.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…