Company Filing History:
Years Active: 2013-2016
Title: Sangwon Oh: Innovator in Anisotropic Conductive Adhesives
Introduction
Sangwon Oh is a prominent inventor based in Daejeon, South Korea. He has made significant contributions to the field of electronics, particularly in the development of anisotropic conductive adhesives. With a total of 4 patents to his name, his work has been influential in advancing technology in this area.
Latest Patents
One of Sangwon Oh's latest patents focuses on the composition and methods of forming solder bumps and flip chips. This patent provides a composition for an anisotropic conductive adhesive that includes a low melting point solder particle and a thermo-curable polymer resin. The method involves forming a mixture by combining a polymer resin with a curing agent, along with a deforming agent, a catalyst, or a reductant. This innovative approach enhances the efficiency and effectiveness of solder bump and flip chip formation.
Career Highlights
Sangwon Oh is affiliated with the Electronics and Telecommunications Research Institute, where he continues to push the boundaries of technology. His work has garnered attention for its practical applications in the electronics industry, particularly in improving the reliability and performance of electronic components.
Collaborations
Throughout his career, Sangwon Oh has collaborated with notable colleagues, including Yong Sung Eom and Jong Tae Moon. These partnerships have contributed to the successful development of his innovative technologies.
Conclusion
Sangwon Oh's contributions to the field of anisotropic conductive adhesives demonstrate his commitment to innovation in electronics. His patents reflect a deep understanding of materials and methods that enhance electronic manufacturing processes. His work continues to influence the industry and pave the way for future advancements.