The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 04, 2016
Filed:
Jul. 08, 2014
Applicant:
Electronics and Telecommunications Research Institute, Daejeon, KR;
Inventors:
Yong Sung Eom, Daejeon, KR;
Jong Tae Moon, Gyeryong-si, KR;
Sangwon Oh, Daejeon, KR;
Keonsoo Jang, Suwon-si, KR;
Assignee:
ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE, Daejeon, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 13/04 (2006.01); B23K 3/06 (2006.01); B23K 35/34 (2006.01); B23K 35/36 (2006.01); B82Y 10/00 (2011.01); B23K 35/24 (2006.01); H05K 3/46 (2006.01); H01L 23/00 (2006.01); H05K 3/32 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
H05K 13/0465 (2013.01); B23K 3/0623 (2013.01); B23K 35/24 (2013.01); B23K 35/34 (2013.01); B23K 35/3601 (2013.01); B23K 35/3613 (2013.01); B82Y 10/00 (2013.01); H01L 24/29 (2013.01); H01L 24/30 (2013.01); H01L 24/83 (2013.01); H05K 3/3484 (2013.01); H05K 3/46 (2013.01); B23K 2201/36 (2013.01); H01L 2224/1141 (2013.01); H01L 2224/1152 (2013.01); H01L 2224/1184 (2013.01); H01L 2224/16238 (2013.01); H01L 2224/2784 (2013.01); H01L 2224/27416 (2013.01); H01L 2224/3003 (2013.01); H01L 2224/73104 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/81355 (2013.01); H01L 2224/83886 (2013.01); H05K 3/323 (2013.01); H05K 3/3436 (2013.01); H05K 2201/026 (2013.01); H05K 2201/10977 (2013.01); Y10T 29/49117 (2015.01); Y10T 29/49126 (2015.01);
Abstract
Provided are a composition for an anisotropic conductive adhesive, a method of forming a solder bump and a method of forming a flip chip using the same. The composition for an anisotropic conductive adhesive includes a low melting point solder particle and a thermo-curable polymer resin. The anisotropic conductive adhesive includes forming a mixture by mixing a polymer resin and a curing agent, and mixing a deforming agent, a catalyst or a reductant with the mixture.