This inventor holds 1 USPTO granted patent. Top assignee: Samsung Electronics Ltd.. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Sangtae Lee and His Circuit Board Module Patent.
Introduction
Sangtae Lee is an inventor based in Suwon-si, South Korea, associated with Samsung Electronics Ltd. His patent work includes a circuit board module and a method for manufacturing it.
Latest Patents
Lee is credited with 1 patent: “Circuit Board Module and Method for Manufacturing Same.” The invention describes a module with first and second substrates connected by an interposer that creates a space between them. A sealing member covers an inlet in the second substrate and includes an insertion area for a nozzle used to inject filler through the inlet. Openings in at least one of the substrates or the interposer allow air to enter and leave the space during the process.
Career Highlights
Lee’s listed patent focuses on the structure and manufacture of a circuit board module, including the arrangement of its substrates, interposer, sealing member, and air openings. His work is associated with Samsung Electronics Ltd.
Collaborations
Lee’s listed coworkers include Yonglak Cho and Joohan Kim.
Conclusion
Sangtae Lee’s patent describes a circuit board module designed to support filler injection while managing airflow between its substrates.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile