Cheonan, South Korea

Sangsoo Kim

This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignees: New Power Plasma., Ltd., Samsung Electronics Ltd.. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Sangsoo Kim. Retrieved from https://idiyas.com/inventor/sangsoo-kim-4733jvu0

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 1 

Average Co-Inventor Count = 1.0

ph-index = 1


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Sangsoo Kim and Plasma Surface Treatment Innovation.

Introduction

Sangsoo Kim is an inventor associated with Cheonan, South Korea. His patent work concerns plasma surface treatment for semiconductor manufacturing, with a focus on treating package structures while protecting integrated circuit chips and circuit boards.

Latest Patents

The available information lists one patent for Kim: Apparatus for Conducting Plasma Surface Treatment, Board Treatment System Having the Same, and Method of Manufacturing Semiconductor Devices Using the Same.

The invention describes a process chamber connected by a supply duct to an external plasma generator, which produces process radicals for surface treatment. A heat exchanger cools the radicals as they pass through the duct, while a flow controller regulates their movement and discharge. The system is designed to treat package structures with narrow mounting gaps while reducing the risk of damage to the chip and board. Kim’s listed patent count is 1 patent.

Career Highlights

Kim’s listed company affiliations include Samsung Electronics and New Power Plasma. His patent reflects work in plasma processing and semiconductor-device manufacturing.

Collaborations

Junyoung Oh and Jaeho Kwak are identified as Kim’s coworkers. The available information does not specify their roles in the patent or the invention.

Conclusion

Sangsoo Kim’s listed invention addresses a practical semiconductor-manufacturing challenge by applying plasma surface treatment to tightly spaced package structures while helping protect sensitive components.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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