Location History:
- Rancho Palos Verdes, CA (US) (2006)
- Santa Barbara, CA (US) (2008)
Company Filing History:
Years Active: 2006-2008
Title: Innovations of Sangmin Lee
Introduction
Sangmin Lee is a notable inventor based in Santa Barbara, California. He has made significant contributions to the field of semiconductor technology, particularly in the bonding of semiconductor chips.
Latest Patents
Sangmin Lee holds two patents, with his latest focusing on a method and system for bonding a semiconductor chip onto a carrier using micro-pins. This invention introduces an anisotropically conductive layer (ACL) that facilitates both mechanical and electrical bonding between two circuit-containing structures, such as a flip chip and a carrier. The ACL is constructed from a rigid insulating substrate or membrane, featuring top and bottom planar surfaces embedded with a multitude of pins. These pins extend beyond the surfaces, allowing for exposure that ensures electrical connections between the flip chip and carrier. Additionally, they provide mechanical support, enabling the flip chip to endure post-bonding processing without significant deformation or breakage. The patent also outlines methods for electrically and mechanically bonding the flip chip and carrier, as well as for manufacturing a semiconductor device utilizing the ACL.
Career Highlights
Sangmin Lee is affiliated with the State University of New York, where he continues to advance his research and innovations in semiconductor technology. His work has garnered attention for its practical applications in the electronics industry.
Collaborations
Some of his notable coworkers include Michael A Gurvitch and Serge Luryi, who have collaborated with him on various projects related to semiconductor technology.
Conclusion
Sangmin Lee's contributions to semiconductor bonding technology highlight his innovative spirit and dedication to advancing the field. His patents reflect a commitment to improving the reliability and efficiency of electronic devices.