The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 20, 2006
Filed:
Jul. 26, 2001
Sangmin Lee, Rancho Palos Verdes, CA (US);
Michael Gurvitch, Stony Brook, NY (US);
Serge Luryi, Setauket, NY (US);
Sangmin Lee, Rancho Palos Verdes, CA (US);
Michael Gurvitch, Stony Brook, NY (US);
Serge Luryi, Setauket, NY (US);
The Research Foundation of State University of New York, Stony Brook, NY (US);
Abstract
An anisotropically conductive layer 'ACL' () for mechanical and electrical bonding of two circuit containing structures, such as a flip chip and carrier is disclosed. The ACL is formed of a rigid insulating substrate () or membrane () with a top and bottom planar surfaces formed with a plurality of pins therein. The pins extend beyond the top and bottom surfaces so that a portion of each pin is exposed. The pins provide electrical connection between contact terminals or pads of the flip chip and carrier and additionally provide mechanical support between the flip chip and carrier so that the flip chip can under go post-bonding processing without substantial deformation or breaking. A method of electrically and mechanically bonding the flip chip and carrier and a method of making a semiconductor device using the ACL is also disclosed.