Asan, South Korea

Sangmin An

This inventor holds 1 USPTO granted patent. Top assignee: Samsung Electronics Co., Ltd.. Active years: 2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Sangmin An. Retrieved from https://idiyas.com/inventor/sangmin-an-tz9lwpnr

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 6.0

ph-index = 1


Company Filing History:


Years Active: 2025

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1 patent (USPTO):Explore Patents

Title: Innovator Sangmin An and His Contributions to Multi-Chip Package Technology.

Introduction

Sangmin An is a notable inventor based in Asan, South Korea. He has made significant contributions to the field of semiconductor technology, particularly in the development of multi-chip packages (MCP). His innovative approach has led to advancements that enhance the functionality and reliability of storage devices.

Latest Patents

Sangmin An holds a patent for a "Test method of storage device implemented in multi-chip package (MCP) and method of manufacturing an MCP including the test method." This patent outlines a method for manufacturing an MCP that includes a first type semiconductor chip, a second type semiconductor chip, and a memory controller. The method involves several steps, including mounting the chips on a substrate and performing function tests to detect potential defects.

Career Highlights

Sangmin An is currently employed at Samsung Electronics Co., Ltd., a leading company in the electronics industry. His work focuses on improving the efficiency and reliability of semiconductor devices. With 1 patent to his name, he has established himself as a key player in the field of semiconductor innovation.

Collaborations

Throughout his career, Sangmin An has collaborated with talented individuals such as Haengjin Lee and Taehwan Oh. These collaborations have fostered a creative environment that encourages the development of cutting-edge technologies.

Conclusion

Sangmin An's contributions to the field of multi-chip package technology exemplify the importance of innovation in the semiconductor industry. His work not only enhances the performance of storage devices but also paves the way for future advancements in technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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