Seoul, South Korea

SangHyun Son

USPTO Granted Patents = 3 

Average Co-Inventor Count = 4.0

ph-index = 1


Company Filing History:


Years Active: 2024-2025

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3 patents (USPTO):Explore Patents

Title: The Innovative Contributions of SangHyun Son

Introduction

SangHyun Son is a prominent inventor based in Seoul, South Korea. He has made significant contributions to the field of semiconductor technology, holding a total of 3 patents. His work focuses on developing advanced interconnect devices and semiconductor assemblies that enhance the performance and efficiency of electronic components.

Latest Patents

SangHyun Son's latest patents include an innovative interconnect device and a semiconductor device that incorporates electrical components over the side surfaces of an interconnect substrate. The interconnect device features an insulating frame with multiple layers, including a top insulating layer, a bottom insulating layer, and a central insulating layer with through-holes. This design allows for the integration of bridge conductors that enhance connectivity. Additionally, his semiconductor device utilizes a conductive via and an electrical interconnect compound, enabling the placement of electrical components on the side surfaces of the substrate, which optimizes space and functionality.

Career Highlights

SangHyun Son is currently employed at Stats Chippac Pte. Ltd., where he continues to push the boundaries of semiconductor technology. His expertise in interconnect devices has positioned him as a key player in the industry, contributing to advancements that are crucial for modern electronic applications.

Collaborations

Throughout his career, SangHyun Son has collaborated with talented individuals such as GunHyuck Lee and YuJeong Jang. These partnerships have fostered a creative environment that encourages innovation and the development of cutting-edge technologies.

Conclusion

SangHyun Son's contributions to the field of semiconductor technology are noteworthy and impactful. His innovative patents and collaborative efforts continue to shape the future of electronic components.

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