Sangho Cha

Title: Sangho Cha: Semiconductor and Polymer Innovations.

Introduction

Sangho Cha is an inventor associated with Suwon, South Korea. His patent work spans semiconductor-device fabrication and the preparation of polylactic acid resin. The available information lists 2 patents and identifies Samsung Electronics Co., Ltd. and SNU R&DB Foundation among his professional affiliations.

Latest Patents

One of Cha’s listed patents, “Semiconductor Device and Method of Fabricating the Same,” describes a semiconductor chip with a pad, a protective layer that exposes part of the pad, and an electrically connected bump structure. The bump structure includes a metal layer and a solder ball. The patent specifies that the metal layer’s width is about 0.85 to 0.95 times the width of the protective layer’s opening.

Another listed patent, “Polylactic Acid Preparation Method, Polylactic Acid Resin Prepared Using the Method, Resin Composition Comprising the Polylactic Acid Resin, and Catalyst System for Preparing Polylactic Acid,” concerns producing polylactic acid by combining lactide with a main catalyst and a cocatalyst. The main catalyst includes an organometallic compound, while the cocatalyst includes a nanoparticle. The disclosure also covers the resulting resin and compositions containing it.

Career Highlights

Cha’s listed affiliations include Samsung Electronics Co., Ltd. and SNU R&DB Foundation. His patent topics reflect work in both semiconductor packaging and polymer materials, connecting device fabrication with chemical processes for producing resin.

Collaborations

Hyunkee Hong and Changduk Kang are identified as Cha’s coworkers. The available information does not specify their roles in the listed patents.

Conclusion

Sangho Cha’s listed inventions address practical challenges in semiconductor-device construction and polylactic acid production, illustrating the range of his patent work.