Hwaseong, South Korea

Sang-sick Park

This inventor holds 5 USPTO granted patents and 5 published patent applications. Top assignee: Samsung Electronics Co., Ltd.. Active years: 2024-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Sang-sick Park. Retrieved from https://idiyas.com/inventor/sang-sick-park-8p7fba5t

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 5 

% Patents Active = 100.0

Average Co-Inventor Count = 3.3

ph-index = 1

Forward Citations = 2(Granted Patents)


Company Filing History:


Years Active: 2024-2025

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5 patents (USPTO):Explore Patents

Title: Innovations of Sang-sick Park

Introduction

Sang-sick Park is a notable inventor based in Hwaseong-si, South Korea. He has made significant contributions to the field of semiconductor technology, holding a total of four patents. His work focuses on enhancing the efficiency and functionality of semiconductor packages.

Latest Patents

One of his latest patents is a semiconductor package with increased thermal radiation efficiency. This invention includes a first die with signal and dummy regions, featuring first vias in the signal region. A second die is placed on the first die, incorporating second vias in the signal region. The design includes first die pads on the top surface of the first die, which are coupled to the first vias, and first connection terminals that link the second vias to the first vias. The second die pads are located in the dummy region and are electrically insulated from the first and second vias. Each of these pads has a rectangular planar shape, with its major axis oriented away from the signal region.

Another significant patent is related to semiconductor packages and their fabrication methods. This invention describes a semiconductor package that comprises connection terminals between a first die and a second die. The first die has signal and peripheral regions, including first vias on the peripheral region. The second die is positioned on the first die, with second vias corresponding to the first vias. The connection terminals serve to connect the second vias to the first vias, with specific configurations for the first and second connection terminals based on their locations.

Career Highlights

Sang-sick Park is currently employed at Samsung Electronics Co., Ltd., a leading company in the technology sector. His work at Samsung has allowed him to contribute to cutting-edge innovations in semiconductor technology.

Collaborations

He has collaborated with notable coworkers, including Un-Byoung Kang and Seon Gyo Kim, who have also made significant contributions to the field.

Conclusion

Sang-sick Park's innovative work in semiconductor technology has led to advancements that enhance thermal efficiency and fabrication methods. His contributions continue to impact the industry positively.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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