Company Filing History:
Years Active: 2002
Title: The Innovations of Sang Ro Lee
Introduction
Sang Ro Lee is a notable inventor based in Changwon-shi, South Korea. He has made significant contributions to the field of electroplating technology, particularly in the preparation of thin film materials. His work is recognized for its potential to advance manufacturing processes in various applications.
Latest Patents
Sang Ro Lee holds a patent for an "Electroplating process for preparing a Ni layer of biaxial texture." This patent discloses a method for forming an Ni-plated layer characterized by its biaxial texture through electroplating. The Ni-plated layer exhibits peaks measured on a θ-rocking curve with a full width at half maximum (FWHM) of 7° or less regarding the misorientation on the c-axis. Additionally, peaks measured on a φ-scan have a FWHM of 21° or less concerning the misorientation on the plane formed by the a-axis and the b-axis. The process involves electroplating the Ni layer under a magnetic field and subjecting it to thermal treatment to enhance the biaxial texture. This innovation is expected to significantly contribute to the development of electroplating technology and may replace vacuum deposition methods used for preparing thin film magnetic and piezoelectric materials.
Career Highlights
Sang Ro Lee is affiliated with the Korea Institute of Machinery and Materials, where he continues to engage in research and development. His work has garnered attention for its practical applications in the industry, particularly in enhancing the efficiency and effectiveness of electroplating processes.
Collaborations
Sang Ro Lee has collaborated with notable colleagues, including Kyu Hwan Lee and Hyung-Sik Chung. Their combined expertise has contributed to advancements in their respective fields and has fostered a collaborative environment for innovation.
Conclusion
Sang Ro Lee's contributions to electroplating technology exemplify the impact of innovative thinking in engineering and materials science. His patent for the electroplating process represents a significant step forward in the preparation of advanced materials.
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