Cheonan-si, South Korea

Sang Min Yong


Average Co-Inventor Count = 3.0

ph-index = 1


Company Filing History:


Years Active: 2021-2023

Loading Chart...
2 patents (USPTO):Explore Patents

Title: Sang Min Yong: Innovator in Semiconductor Packaging

Introduction

Sang Min Yong is a notable inventor based in Cheonan-si, South Korea. He has made significant contributions to the field of semiconductor packaging, holding a total of 2 patents. His work is primarily associated with Samsung Electronics Co., Ltd., where he continues to innovate and develop advanced technologies.

Latest Patents

Sang Min Yong's latest patents focus on semiconductor packages. The first patent describes a semiconductor package that includes a first substrate, a second substrate placed on the first substrate, and a first semiconductor chip located on the second substrate. A stiffener extends from the upper surface of the first substrate to the upper surface of the second substrate, ensuring that it does not contact the first semiconductor chip. Notably, the height from the upper surface of the first substrate to the upper surface of the first semiconductor chip is greater than the height from the upper surface of the first substrate to the uppermost surface of the stiffener. This innovative design enhances the performance and reliability of semiconductor packages.

Career Highlights

Throughout his career, Sang Min Yong has demonstrated a strong commitment to advancing semiconductor technology. His work at Samsung Electronics Co., Ltd. has positioned him as a key player in the industry. His patents reflect his expertise and innovative thinking, contributing to the company's reputation for cutting-edge technology.

Collaborations

Sang Min Yong has collaborated with talented colleagues, including Yang Gyoo Jung and Chul Woo Kim. These partnerships have fostered a creative environment that encourages the development of groundbreaking technologies in semiconductor packaging.

Conclusion

Sang Min Yong is a distinguished inventor whose contributions to semiconductor packaging have made a significant impact in the field. His innovative patents and collaborative efforts at Samsung Electronics Co., Ltd. highlight his dedication to advancing technology.

This text is generated by artificial intelligence and may not be accurate.
Please report any incorrect information to support@idiyas.com
Loading…