Samsung Electronics Co., Ltd.

Sang Min Yong

Yang Gyoo Jung

Chul Woo Kim

Chui Woo Kim

A semiconductor package is provided. The semiconductor package comprises a first substrate, a second substrate disposed on the first substrate, a first semiconductor chip disposed on the second substrate, and a stiffener extending from an upper surface of the first substrate to an upper surface of the second substrate, the stiffener not being in contact with the first semiconductor chip, wherein a first height from the upper surface of the first substrate to an upper surface of the first semiconductor chip is greater than a second height from the upper surface of the first substrate to an uppermost surface of the stiffener.

Growing community of inventors

Cheonan-si, South Korea

Sang Min Yong