This inventor holds 1 USPTO granted patent and 3 published patent applications. Top assignee: Samsung Electronics Co., Ltd.. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Sang-Hyuck Oh: Innovator in Semiconductor Technology
Introduction
Sang-Hyuck Oh is an inventor based in Suwon-si, South Korea. He has made significant contributions to the field of semiconductor technology. His innovative ideas focus on enhancing the efficiency and functionality of semiconductor packages.
Latest Patent Applications
Sang-Hyuck Oh has filed a patent application for a "REDISTRIBUTION SUBSTRATE, SEMICONDUCTOR PACKAGE INCLUDING THE SAME, AND METHOD OF FABRICATING REDISTRIBUTION SUBSTRATE." This application describes a redistribution substrate that includes first and second insulating layers, a wiring layer, and a metal layer. The wiring pattern features a via portion that penetrates the first insulating layer and a pad portion on the via portion, extending onto the upper surface of the first insulating layer. The metal layer covers the upper surface of the wiring pattern, while the second insulating layer is provided on the first insulating layer, covering the pad portion and the metal layer. The wiring pattern includes a first metal, and the metal layer consists of both the first metal and a second metal. Notably, the concentration of the first metal in the first portion of the metal layer is greater than in the second portion.
Conclusion
Sang-Hyuck Oh is an emerging inventor in the semiconductor field, with a focus on innovative substrate technologies. His work has the potential to influence future developments in semiconductor packaging.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile