Jeonju, South Korea

Sang-hun Lee


Average Co-Inventor Count = 4.0

ph-index = 1

Forward Citations = 11(Granted Patents)


Company Filing History:


Years Active: 2002

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1 patent (USPTO):Explore Patents

Title: The Innovations of Sang-hun Lee

Introduction

Sang-hun Lee is a notable inventor based in Jeonju, South Korea. He has made significant contributions to the field of semiconductor packaging through his innovative designs and methods. His work is particularly recognized for its impact on the efficiency and reliability of electronic components.

Latest Patents

Sang-hun Lee holds a patent for a lead frame and method for plating the same. This invention involves a lead frame designed for semiconductor packages, which enhances the manufacturing process. The method includes forming a protective layer with nickel or nickel alloy on a metal substrate, followed by an intermediate layer of palladium or palladium alloy. The outermost layer is created by alternately plating palladium and gold on the surface of the intermediate layer, resulting in a robust and effective lead frame.

Career Highlights

Sang-hun Lee is currently employed at Samsung Aerospace Industries, Ltd., where he continues to innovate in the field of semiconductor technology. His expertise and dedication have positioned him as a valuable asset to the company and the industry at large.

Collaborations

Throughout his career, Sang-hun Lee has collaborated with talented individuals such as Kyu-han Lee and Sung-il Kang. These partnerships have fostered a creative environment that encourages the development of groundbreaking technologies.

Conclusion

Sang-hun Lee's contributions to semiconductor packaging through his innovative patent demonstrate his commitment to advancing technology. His work not only enhances the manufacturing process but also plays a crucial role in the reliability of electronic devices.

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