Sang Gyun Lee

Title: Innovations of Sang Gyun Lee

Introduction

Sang Gyun Lee is a notable inventor based in Osan, South Korea. He has made significant contributions to the field of semiconductor technology, holding a total of 2 patents. His work focuses on advanced semiconductor assemblies, which are crucial for modern electronic devices.

Latest Patents

One of his latest patents is a semiconductor assembly with a package on package (POP) structure. This innovative assembly includes a first semiconductor package with a first lower substrate, a first upper substrate facing the first lower substrate, and a first semiconductor chip mounted on the first lower substrate. The POP structure also features a second semiconductor package with a second lower substrate stacked on the first semiconductor package and spaced apart from it. Additionally, a second semiconductor chip is mounted on the second lower substrate. At least one passive element is integrated into either the first upper substrate or the second lower substrate, which is electrically connected to the second semiconductor chip. This invention enhances the efficiency and compactness of electronic devices.

Career Highlights

Sang Gyun Lee has worked with prominent companies in the technology sector, including Samsung Electronics Co., Ltd. and Recordati Ireland Limited. His experience in these organizations has allowed him to develop and refine his innovative ideas in semiconductor technology.

Collaborations

He has collaborated with notable coworkers such as Se Young Jang and Kwang Sub Lee, contributing to various projects that have advanced the field of electronics.

Conclusion

Sang Gyun Lee's contributions to semiconductor technology through his patents and collaborations highlight his role as an influential inventor in the industry. His work continues to impact the development of modern electronic devices.