Company Filing History:
Years Active: 1991
Title: Innovations of Samuel Malbaurn in Multilayer Circuit Board Manufacturing
Introduction
Samuel Malbaurn is an accomplished inventor based in Dayville, CT (US). He has made significant contributions to the field of circuit board manufacturing. His innovative approach has led to the development of a unique method for fabricating multilayer circuits.
Latest Patents
Samuel holds a patent for a "Method of manufacturing a multilayer circuit board." This patent presents methods of fabricating multilayer circuits by stacking a plurality of circuit layers. Each layer consists of a dielectric substrate with a circuit formed on it. The dielectric substrate is made from a polymeric material capable of undergoing fusion bonding, such as a fluoropolymeric-based substrate. Fusible conductive bonding material, like solder, is applied to selected exposed circuit traces before the stacking step. The entire stack is then subjected to lamination under heat and pressure, which fuses all substrate and conductive layers together, resulting in an integral multilayer circuit with solid conductive interconnects.
Career Highlights
Samuel Malbaurn is associated with Rogers Corporation, a company known for its advanced materials and solutions in the electronics industry. His work has been pivotal in enhancing the efficiency and reliability of multilayer circuit boards.
Collaborations
Samuel has collaborated with notable coworkers, including Robert C. Daigle and David B. Noddin. Their combined expertise has contributed to the success of various projects within the company.
Conclusion
Samuel Malbaurn's innovative methods in multilayer circuit board manufacturing have paved the way for advancements in the electronics industry. His contributions continue to influence the development of reliable and efficient circuit technologies.