Saman Mi Adham

Title: Saman Mi Adham: Innovator in 3D Integrated Circuits

Introduction

Saman Mi Adham is a notable inventor based in Kanata, Canada. He has made significant contributions to the field of integrated circuits, particularly in the area of interconnect testing for 3D architectures. His innovative approach has led to the development of a unique patent that enhances the efficiency and reliability of circuit designs.

Latest Patents

Saman Mi Adham holds a patent for a "Scan architecture for interconnect testing in 3D integrated circuits." This invention involves a device comprising a first die with a first plurality of latches, which are operatively connected to adjacent latches. Additionally, a second die contains a second plurality of latches, also connected to each other. Each latch on the first die corresponds to a latch on the second die, creating a closed loop scan path that enhances testing capabilities.

Career Highlights

Saman Mi Adham is currently employed at Taiwan Semiconductor Manufacturing Company Limited, a leading firm in the semiconductor industry. His work focuses on advancing technologies that improve the performance and testing of integrated circuits. His expertise in this area has positioned him as a valuable asset to his team and the industry.

Collaborations

Saman has collaborated with notable colleagues such as Sandeep Kumar Goel and Yun-Han Lee. These partnerships have fostered innovation and contributed to the development of cutting-edge technologies in the field of semiconductor manufacturing.

Conclusion

Saman Mi Adham's contributions to the field of 3D integrated circuits through his patent and work at Taiwan Semiconductor Manufacturing Company Limited highlight his role as an influential inventor. His innovative solutions continue to shape the future of semiconductor technology.