Sam Lai

Title: The Innovations of Sam Lai

Introduction

Sam Lai is a notable inventor based in Taichung, Taiwan. He has made significant contributions to the field of semiconductor technology. His innovative work has led to the development of a unique semiconductor device and a method for manufacturing it.

Latest Patents

Sam Lai holds a patent for a semiconductor device and a method for manufacturing the same. This patent outlines a method that includes several steps. A substrate is provided with a first dielectric layer. The first dielectric layer is then provided with a trench. Following this, a metal layer is formed to fill the trench and cover the surface of the first dielectric layer. The metal layer is partially removed, leaving a remaining portion that covers the first dielectric layer. A treatment process is performed to transform this remaining portion into a passivation layer on the top and a gate metal layer on the bottom. Finally, a chemical-mechanical polishing process is conducted until the first dielectric layer is exposed, ensuring that a remaining portion of the passivation layer remains in the trench.

Career Highlights

Sam Lai is currently employed at United Microelectronics Corporation, a leading company in the semiconductor industry. His work at this organization has allowed him to further his research and development efforts in semiconductor technology.

Collaborations

Sam has collaborated with notable coworkers, including Shih-Chang Tsai and Tzu-Chin Tseng. Their combined expertise has contributed to advancements in their field.

Conclusion

Sam Lai's innovative work in semiconductor technology exemplifies the impact of dedicated inventors in advancing modern technology. His patent and contributions to United Microelectronics Corporation highlight his role in shaping the future of semiconductor devices.