This inventor holds 4 USPTO granted patents and 3 published patent applications. Top assignee: Liquid Wire Inc.. Active years: 2023-2025.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Location History:
- Corvallis, OR (US) (2023)
- Beaverton, OR (US) (2023 - 2024)
Company Filing History:
Years Active: 2023-2025
Title: Innovations of Sai Srinivas Desabathina
Introduction
Sai Srinivas Desabathina is an accomplished inventor based in Corvallis, Oregon. He has made significant contributions to the field of materials science, particularly in the development of innovative interconnects between heterogeneous materials. With a total of four patents to his name, Desabathina continues to push the boundaries of technology.
Latest Patents
One of his latest patents focuses on continuous interconnects between heterogeneous materials. This invention describes a structure that includes a first material and a second material joined at a junction. The design features one or more media extending across the junction to create a continuous interconnect between the two materials. The first and second materials are heterogeneous, and the structure may also include a transition at the junction. The media can consist of a functional material that is electrically conductive. Additionally, the invention allows for a third material to be joined to the second material, further enhancing the interconnectivity between the materials.
Career Highlights
Desabathina is currently employed at Liquid Wire Inc., where he applies his expertise in materials science to develop cutting-edge technologies. His work has garnered attention for its potential applications in various industries, including electronics and telecommunications.
Collaborations
Some of his notable coworkers include Mark William Ronay and Jorge E Carbo. Their collaborative efforts contribute to the innovative environment at Liquid Wire Inc.
Conclusion
Sai Srinivas Desabathina is a prominent inventor whose work in continuous interconnects between heterogeneous materials showcases his commitment to advancing technology. His contributions are paving the way for future innovations in materials science.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile