Sai Man Li

Title: Innovations of Inventor Sai Man Li

Introduction

Sai Man Li is a notable inventor based in Tainan, Taiwan. He has made significant contributions to the field of semiconductor technology, holding two patents that showcase his expertise and innovative spirit.

Latest Patents

One of Sai Man Li's latest patents is for a semiconductor chip package and manufacturing method. This invention generally comprises a lead frame, a semiconductor die, and a plastic package body. The lead frame includes a plurality of leads and a window pad, which is connected to the lead frame by connecting bars. The inner ends of the plurality of leads define a central area, where the window pad is disposed and has an opening defined therein. The semiconductor die is placed in the opening of the window pad and features a plurality of bonding pads formed on its active surface. The inner ends of the leads are interconnected to the bonding pads on the semiconductor die through a series of bonding wires. The lead frame, semiconductor die, and bonding wires are encapsulated in the plastic package body, with the lower surface of the lead frame and the backside surface of the semiconductor die exposed through the plastic package body.

Career Highlights

Throughout his career, Sai Man Li has worked with Advanced Semiconductor Engineering, Inc., where he has honed his skills and contributed to various projects in semiconductor packaging technology. His work has been instrumental in advancing the efficiency and reliability of semiconductor devices.

Collaborations

Sai Man Li has collaborated with several professionals in his field, including Chun Hung Lin and Shin Hua Chao, who have contributed to his projects and innovations.

Conclusion

Sai Man Li's contributions to semiconductor technology through his patents and career achievements highlight his role as an influential inventor in the industry. His work continues to impact the development of advanced semiconductor packaging solutions.