Saeed Shafiyan-Rad

Title: The Innovative Contributions of Saeed Shafiyan-Rad

Introduction

Saeed Shafiyan-Rad is a notable inventor based in Nashua, NH (US). He has made significant contributions to the field of electronic packaging, particularly in the development of hermetic packages for power semiconductors. With a total of 10 patents to his name, his work has had a substantial impact on the industry.

Latest Patents

Saeed's latest patents include a method for forming a hermetic package for a power semiconductor. This method involves providing a package body, hermetically coupling a package base plate to the package body, and thermally coupling a substrate to the base plate. Additionally, it includes thermally mounting a semiconductor device to the substrate and bonding at least one high-current input/output (I/O) terminal to the first metalized region of the substrate using a strap terminal that serves as an integral high current heatsink terminal. The design also features a ceramic seal that surrounds the high-current I/O terminal, which is hermetically bonded to the outer surface of the package body. Furthermore, a metal hermetic seal washer is bonded to both the ceramic seal and a portion of the high-current I/O terminal, ensuring a robust and reliable package.

Another of his patents describes a hermetic high-current electronic package that includes a package body and a base plate hermetically coupled to the package body. In this design, a semiconductor device is thermally mounted to the base plate and has a high-current output. The high-current I/O terminal is bonded to the high-current output of the semiconductor device by a strap terminal, which is also an integral high current heatsink terminal. This terminal passes through a hole formed in the sidewall of the package body, surrounded by a ceramic seal that is hermetically bonded to the outer surface of the sidewall.

Career Highlights

Throughout his career, Saeed has worked with reputable companies such as Rockwell Automation Technologies Incorporated and Rockwell Technologies, Inc. His experience in these organizations has allowed him to refine his skills and contribute to innovative projects in the field of electronic packaging.

Collaborations

Saeed has collaborated with talented individuals in his field, including Daniel M Corbosiero and Mark Stephen Schladenhauffen. These collaborations have further enhanced his work and contributed to the success of his inventions.