Rockwell Automation Technologies Incorporated

Microsemi Corporation

Rockwell Technologies, Inc.

Saeed Shafiyan-Rad

Daniel M Corbosiero

Mark Stephen Schladenhauffen

Weihua Chen

David Scott Doiron

Manuel Medeiros, Iii

Isak Kayserman

Larry Joseph Fisher

Larry Joseph Fischer

A method for fabricating a hermetic electronic package includes providing a package body; hermetically coupling a package base plate to the package body; thermally coupling a substrate to the base plate; thermally mounting a semiconductor device to the substrate; bonding at least one high-current input/output (I/O) terminal to the first metalized region of the substrate by a strap terminal that is an integral high current heatsink terminal. A ceramic seal surrounding the at least one high-current I/O terminal is hermetically bonded to an outer surface of the package body. A metal hermetic seal washer surrounding the at least one high-current I/O terminal is hermetically bonded to the ceramic seal and to a portion of the at least one high-current I/O terminal. A lid is seam welded onto the package body.

Method for forming hermetic package for a power semiconductor

A hermetic high-current electronic package includes a package body and a base plate hermetically coupled to the package body. A semiconductor device is thermally mounted to the base plate and has a high-current output. A high-current input/output (I/O) terminal is bonded to the high-current output of the semiconductor device by a strap terminal that is an integral high current heatsink terminal. The high-current I/O terminal passes through a hole formed in a sidewall of the package body. A ceramic seal surrounds the high-current I/O terminal and has a first surface hermetically bonded to an outer surface of the sidewall of the package body. A metal hermetic seal washer surrounds the high-current I/O terminal and is bonded to a second surface of the ceramic seal and bonded to a portion of the high-current I/O terminal that passes through the metal hermetic seal washer.

Hermetic package for power semiconductor

An apparatus includes a sense element and an oscillator. The oscillator is coupled to the sense element and is used to generate an oscillator signal and a gain control signal. The oscillator signal is amplitude compensated when noise is detected in the sense element. A method includes detecting magnetic interference in a sense element coupled to an oscillator, and adjusting a gain control signal in the oscillator to compensate for the magnetic interference.

Sensor and method including noise compensation

An apparatus includes a first circuit, a second circuit, and a capacitor. The first circuit includes a sense element. The capacitor couples the first circuit to the second circuit. The first feedback path couples the second circuit to the first circuit. And the second feedback path couples the second circuit to the first circuit. A method includes generating, for an oscillator signal having an amplitude and a gain, a substantially direct current signal related to an amplitude, and controlling the gain with the substantially direct current signal.

Sensor and method

An indicator apparatus facilitates visibility of one or more indicators from multiple angles. The apparatus includes a housing having an outer sidewall portion. The sidewall portion, for example, has a first side extending between two adjacent sides. One or more elongated slots are formed in the sidewall portion. A substantially translucent material is disposed in the slot so that the translucent material is visible from more than one side of the housing, such as the first side and another side through which the slot extends. A light source is operatively associated with the substantially translucent material for illuminating the material. As a result, when the light source illuminates the substantially translucent material, the illuminated translucent material is visible from more than one side of the housing.

Multi-angle viewable indicator apparatus

An indicator apparatus facilitates visibility of one or more indicators from multiple angles. The apparatus includes a housing having an outer sidewall portion. The sidewall portion, for example, has a first side extending between two adjacent sides. One or more elongated slots are formed in the sidewall portion. One or more light sources are positioned within the one or more elongated slots.

A sensor for measuring a clamp arm position in a power clamp provides a sensor wheel that may fit beneath the clamp arm. A low profile sensor body abuts an edge of the sensory wheel to detect the sensor position without undue change in the power clamp or clearance about the power clamp.

Sensor for power clamp arm

A housing for a proximity sensor is resistant to harsh environmental effects, such as scorching particles due to sputtering in a welding environment. The sensor housing is formed of a material having a high thermal conductivity, such as copper or an alloy thereof. As a result, the housing is able to rapidly dissipate heat and, in turn, mitigate weld slag build-up so as to improve the efficacy of the sensor.

Growing community of inventors

Nashua, NH, United States of America

Saeed Shafiyan-Rad