Company Filing History:
Years Active: 2020-2025
Title: The Innovative Contributions of Sadia Naseem
Introduction
Sadia Naseem is a prominent inventor based in Dallas, TX, known for her significant contributions to the field of technology. With a total of eight patents to her name, she has made remarkable strides in improving the reliability of electronic packaging.
Latest Patents
One of her latest patents is a method for creating a wettable surface for improved reliability in QFN packages. This innovative approach addresses the challenges of copper corrosion and poor BLR performance in no-leads packages. By implementing low-cost and fast metallic printing processes, Sadia's method selectively prints solderable material in areas that are prone to corrosion. This solution effectively coats risk-prone areas with solder material, enhancing the overall reliability of the packages. The process involves depositing solder through various printing techniques into grooves formed after passivating the packages, resulting in wettable upper and sidewall surfaces of the leadframe.
Career Highlights
Sadia Naseem has established herself as a key figure in her field, working at Texas Instruments Corporation. Her work has not only contributed to the advancement of technology but has also set new standards for reliability in electronic packaging.
Collaborations
Sadia collaborates with talented individuals such as Vikas I Gupta and Benjamin Stassen Cook, further enhancing her innovative efforts.
Conclusion
Sadia Naseem's contributions to technology through her patents and innovative methods have made a significant impact on the industry. Her work continues to inspire advancements in electronic packaging and reliability.