The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 11, 2020
Filed:
Sep. 17, 2018
Applicant:
Texas Instruments Incorporated, Dallas, TX (US);
Inventors:
Assignee:
TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US);
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 29/00 (2006.01); H01L 23/12 (2006.01); H01L 23/495 (2006.01); H01L 23/64 (2006.01); H01L 23/00 (2006.01); H01L 21/56 (2006.01); H01F 27/28 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49541 (2013.01); H01F 27/2804 (2013.01); H01L 21/565 (2013.01); H01L 23/49513 (2013.01); H01L 23/49575 (2013.01); H01L 23/645 (2013.01); H01L 24/49 (2013.01); H01L 24/85 (2013.01); H01F 2027/2809 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48195 (2013.01); H01L 2224/48247 (2013.01);
Abstract
A packaged semiconductor device includes a leadframe (LF) having a plurality of laminate-supporting pedestals. A cured first die attach (DA) material is on an outer edge of the pedestals being an ultraviolet (UV)-curing DA material having a photoinitiator or a cured B-stage DA material. A cured thermally-curing DA material is on an area of the pedestals not occupied by the UV-curing DA material. A laminate component having bond pads on a top side is mounted top side up on the plurality of pedestals.