Sadao Kishida

Title: Sadao Kishida: Innovator in Lead-Free Solder Alloys

Introduction

Sadao Kishida is a notable inventor based in Kadoma, Japan. He has made significant contributions to the field of solder alloys, particularly focusing on lead-free compositions suitable for electronic devices. With a total of 2 patents, Kishida's work is pivotal in advancing environmentally friendly materials in technology.

Latest Patents

Kishida's latest patents revolve around lead-free solder alloys that exhibit relatively low melting temperatures. One of his inventions consists of a solder alloy that includes from 7 to 10 wt % of Zn, along with varying amounts of Ni, Ag, and Cu. Additionally, it may contain Bi, In, and P, with the balance being Sn. Another variant of his lead-free solder alloy comprises from 2 to 10 wt % of Zn, 10 to 30 wt % of Bi, and 0.05 to 2 wt % of Ag, also with Sn as the primary component. These alloys are designed to have a tensile strength of at least 5 kgf/mm and a minimum elongation of 10%.

Career Highlights

Throughout his career, Sadao Kishida has focused on developing innovative materials that meet the demands of modern electronics. His expertise in solder alloys has positioned him as a key figure in the industry, contributing to safer and more efficient manufacturing processes.

Collaborations

Kishida has worked alongside notable colleagues such as Toshikazu Murata and Hiroji Noguchi. Their collaborative efforts have further enhanced the development of advanced solder materials.

Conclusion

Sadao Kishida's contributions to lead-free solder alloys represent a significant advancement in the field of electronics. His innovative approach not only addresses environmental concerns but also enhances the performance of electronic devices.