Company Filing History:
Years Active: 1985
Title: Sadao Fujieda: Innovator in Semiconductor Technology
Introduction
Sadao Fujieda is a notable inventor based in Haramachi, Japan. He has made significant contributions to the field of semiconductor technology, particularly through his innovative approaches to manufacturing processes.
Latest Patents
Fujieda holds a patent for a resin-molded semiconductor device and a process for manufacturing it. This process allows for the creation of resin-molded semiconductor devices sealed in epoxy resin without the need for a metal mold. The method involves depositing epoxy resin on a sub-assembly that consists of a semiconductor pellet brazed to axial leads. The sub-assembly is turned with the axial leads as a center, ensuring that the epoxy resin is applied in a predetermined shape. The epoxy resin is then heated at an elevated temperature while turning the sub-assembly, which hardens the surface portions. Finally, the epoxy resin undergoes further heating at an elevated temperature without turning the sub-assembly, resulting in complete hardening.
Career Highlights
Fujieda is associated with Hitachi, Ltd., a leading company in technology and innovation. His work has contributed to advancements in semiconductor manufacturing, showcasing his expertise and commitment to the field.
Collaborations
Fujieda has collaborated with notable coworkers, including Toshiyuki Hidaka and Hisashi Sakamoto. Their combined efforts have furthered research and development in semiconductor technologies.
Conclusion
Sadao Fujieda's contributions to semiconductor technology through his innovative patent demonstrate his significant role in advancing manufacturing processes. His work continues to influence the industry and inspire future innovations.