Company Filing History:
Years Active: 2025
Title: Innovations of Sachin Gupta in Thermal Management
Introduction
Sachin Gupta is an accomplished inventor based in Sherwood, Oregon, known for his contributions to thermal management technologies. He has developed innovative solutions that enhance the performance of high-power integrated circuit (IC) devices. His work is particularly significant in the field of thermal management, where efficient heat dissipation is crucial for device reliability and performance.
Latest Patents
Sachin Gupta holds a patent for a "Micro-channel heatsink with embedded heater and diamond heat spreader." This invention discloses a high-performance thermal chuck designed for enhanced thermal management of high-power IC devices. The thermal chuck provides active heating and cooling for post-manufacture device testing. It features microfluidic channels within a high thermal conductivity silicon carbide (SiC) body, which facilitates improved active cooling of IC devices. Additionally, a refractory heating element is embedded between an integrated diamond heat spreader and the heatsink, allowing for effective active heating. The closely matched coefficients of thermal expansion between the diamond heat spreader and the heatsink help mitigate thermally-induced warpage.
Career Highlights
Sachin Gupta is currently employed at Intel Corporation, where he continues to push the boundaries of thermal management technologies. His work at Intel has positioned him as a key player in the development of advanced thermal solutions for high-performance computing applications.
Collaborations
Throughout his career, Sachin has collaborated with notable colleagues, including Alexander I Mamchik and Jaime A Sanchez. These collaborations have contributed to the advancement of innovative technologies in the field of thermal management.
Conclusion
Sachin Gupta's contributions to thermal management through his innovative patent demonstrate his expertise and commitment to enhancing the performance of integrated circuit devices. His work at Intel Corporation and collaborations with esteemed colleagues further highlight his impact in the field.