This inventor holds 2 USPTO granted patents. Top assignee: Stats Chippac Pte. Ltd.. Active years: 2012-2013.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2012-2013
Title: Innovations by Saat Shukri Bin Embong
Introduction
Saat Shukri Bin Embong is a notable inventor based in Selangor, Malaysia. He has made significant contributions to the field of semiconductor technology, holding 2 patents that showcase his innovative spirit and technical expertise.
Latest Patents
His latest patents include a thermally enhanced semiconductor package system. This system features a semiconductor chip mounted on a substrate with a unique design that includes vertical build-up wings and heat slugs. The first heat slug is attached above the substrate and encapsulates the semiconductor chip, while a second heat slug is positioned above the first, enhancing thermal management. Another patent focuses on a hyper thermally enhanced semiconductor package system, which involves mounting a semiconductor chip to a substrate and utilizing heat slugs on opposite surfaces to improve performance.
Career Highlights
Saat Shukri Bin Embong is currently employed at Stats Chippac Pte. Ltd., where he continues to develop innovative solutions in semiconductor packaging. His work has contributed to advancements in the efficiency and reliability of semiconductor devices.
Collaborations
He has collaborated with talented coworkers, including You Yang Ong and Zurina Binti Zukiffly, to drive innovation within his field.
Conclusion
Through his patents and work at Stats Chippac Pte. Ltd., Saat Shukri Bin Embong exemplifies the spirit of innovation in semiconductor technology. His contributions are paving the way for future advancements in the industry.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile