Singapore, Singapore

S Y John Ho

This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: National University of Singapore. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: S Y John Ho. Retrieved from https://idiyas.com/inventor/s-y-john-ho

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 1 

Average Co-Inventor Count = 1.0

ph-index = 1


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: S Y John Ho and Wearable Immunosensor Innovation.

Introduction

S Y John Ho is an inventor based in Singapore, SG, whose work includes a patent for a thin, flexible wearable immunosensor designed to detect multiple biomarkers or targets in bodily fluids. He is associated with the National University of Singapore.

Latest Patents

Ho is listed on one patent. The invention describes a layered wound dressing with a permeable wound-contact layer, a breathable barrier layer, a biosensor sensing array, and a fluid-collection layer. The collection layer uses capillary action to carry wound fluid from the wound to the sensing array, enabling detection of one or more markers.

Career Highlights

Ho’s patent reflects an approach that combines wound care materials with biosensing technology. The proposed dressing is designed to collect wound fluid and support the detection of biomarkers at the wound site. His listed patent count is 1 patent.

Collaborations

Ho’s listed coworkers include Yuji Gao and Thanh Dat Nguyen. The patent’s focus on a sensing array and fluid-collection layers illustrates the collaborative, interdisciplinary nature of wearable immunosensor development.

Conclusion

S Y John Ho’s patent brings together a flexible wound dressing and biomarker-sensing components, highlighting an innovation aimed at detecting markers in wound fluid.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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