Tokyo, Japan

Ryuuta Kaneda

This inventor holds 2 USPTO granted patents and 1 published patent application. Top assignee: Ricoh Company, Ltd.. Active years: 2021-2022.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Ryuuta Kaneda. Retrieved from https://idiyas.com/inventor/ryuuta-kaneda

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 2 

% Patents Active = 100.0

Average Co-Inventor Count = 4.0

ph-index = 1

Forward Citations = 2(Granted Patents)


Company Filing History:


Years Active: 2021-2022

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2 patents (USPTO):Explore Patents

Title: Ryuuta Kaneda: Innovator in Printing Technology

Introduction

Ryuuta Kaneda is a notable inventor based in Tokyo, Japan. He has made significant contributions to the field of printing technology, holding two patents to his name. His work has been instrumental in advancing the capabilities of printers, particularly in enhancing their efficiency and functionality.

Latest Patents

Ryuuta Kaneda's latest patents focus on innovative printer designs. These patents reflect his commitment to improving printing technology and addressing the evolving needs of consumers and businesses alike.

Career Highlights

Kaneda is currently employed at Ricoh Company, Ltd., a leading organization in the printing and imaging industry. His role at Ricoh has allowed him to collaborate with other talented professionals and contribute to groundbreaking projects that push the boundaries of printing technology.

Collaborations

Throughout his career, Ryuuta Kaneda has worked alongside esteemed colleagues such as Masahiro Ishida and Yuki Sato. These collaborations have fostered a creative environment that encourages innovation and the sharing of ideas.

Conclusion

Ryuuta Kaneda is a prominent figure in the realm of printing technology, with a focus on innovation and collaboration. His contributions continue to shape the future of printing, making him a key player in the industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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