Hitachiota, Japan

Ryutaro Jimbou

This inventor holds 1 USPTO granted patent. Top assignee: Hitachi, Ltd.. Active years: 1987.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Ryutaro Jimbou. Retrieved from https://idiyas.com/inventor/ryutaro-jimbou

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 7.0

ph-index = 1

Forward Citations = 7(Granted Patents)


Company Filing History:


Years Active: 1987

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1 patent (USPTO):Explore Patents

Title: Ryutaro Jimbou and His Diffusion Bonding Invention.

Introduction

Ryutaro Jimbou is an inventor associated with Hitachi, Ltd., in Hitachiota, Japan. His work includes a patent for a diffusion bonding method designed for heat-resistant superalloys.

Latest Patents

Jimbou is credited with 1 patent: “Diffusion Bonding Method Using a High Energy Beam.” The invention describes forming an alloy layer on the joint surface of a base metal made from a heat-resistant superalloy, such as one based on cobalt, nickel, iron, or titanium. The layer contains additional elements that diffuse faster than the base metal’s principal constituent and have lower melting points. The joint surfaces are then brought into contact to promote diffusion bonding, offering a method applicable to superalloys.

Career Highlights

The available information connects Jimbou’s inventive work with Hitachi, Ltd. His patent addresses the technical challenge of joining heat-resistant superalloy materials through diffusion.

Collaborations

The listed coworkers associated with Jimbou are Masahisa Inagaki and Takao Funamoto. The available information does not specify their roles in the patent or their working relationship with him.

Conclusion

Ryutaro Jimbou’s documented contribution is a patented diffusion bonding method intended for heat-resistant superalloys, reflecting an engineering focus on joining advanced materials.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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