Osaka, Japan

Ryuji Tanaka

This inventor holds 5 USPTO granted patents and 1 published patent application. Top assignee: Daihen Corporation. Active years: 2017-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Ryuji Tanaka. Retrieved from https://idiyas.com/inventor/ryuji-tanaka-uijlq5bl

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 5 

% Patents Active = 100.0

Average Co-Inventor Count = 4.0

ph-index = 3

Forward Citations = 45(Granted Patents)


Company Filing History:


Years Active: 2017-2025

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5 patents (USPTO):Explore Patents

Title: Ryuji Tanaka: Innovator in Welding Technology

Introduction

Ryuji Tanaka is a prominent inventor based in Osaka, Japan. He has made significant contributions to the field of welding technology, holding a total of 5 patents. His work has been instrumental in advancing the efficiency and effectiveness of welding processes.

Latest Patents

Among his latest innovations are a wire feeding apparatus for welding and a welding machine. These inventions reflect his commitment to improving welding techniques and equipment, showcasing his expertise in the industry.

Career Highlights

Ryuji Tanaka is currently employed at Daihen Corporation, a leading company in the welding technology sector. His role at Daihen has allowed him to further develop his ideas and bring them to fruition, contributing to the company's reputation for innovation.

Collaborations

Throughout his career, Ryuji has collaborated with talented coworkers, including Junichi Wakita and Daichi Ide. These partnerships have fostered a creative environment that encourages the exchange of ideas and the development of groundbreaking technologies.

Conclusion

Ryuji Tanaka's contributions to welding technology through his patents and collaborations highlight his role as an influential inventor in the field. His work continues to impact the industry positively, paving the way for future innovations.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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