Tokyo, Japan

Ryota Kudo

This inventor holds 2 USPTO granted patents and 1 published patent application. Top assignee: Komatsu Corporation. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Ryota Kudo. Retrieved from https://idiyas.com/inventor/ryota-kudo-34sx1w97

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 2 

Average Co-Inventor Count = 5.0

ph-index = 1


Company Filing History:


Years Active: 2026

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2 patents (USPTO):Explore Patents

Title: Innovations by Ryota Kudo in Excavation Technology

Introduction

Ryota Kudo is a notable inventor based in Tokyo, Japan. He has made significant contributions to the field of excavation technology. His innovative approach has led to the development of a unique method for calculating the angle of repose of excavated objects.

Latest Patents

Ryota Kudo holds 1 patent for his invention titled "Method for calculating angle of repose of excavated object held by bucket, system for calculating angle of repose of excavated object held by bucket, and loading machine." This method involves calculating a bucket angle, measuring the weight of the excavated object, and determining the angle of repose based on various data inputs.

Career Highlights

Kudo is currently employed at Komatsu Corporation, a leading company in the construction and mining equipment industry. His work focuses on enhancing the efficiency and accuracy of excavation processes through innovative technologies.

Collaborations

Ryota Kudo has collaborated with esteemed colleagues such as Takahisa Oasa and Shozo Kikuchi. Their combined expertise contributes to the advancement of excavation technology and the development of new methodologies.

Conclusion

Ryota Kudo's contributions to excavation technology exemplify the impact of innovation in the industry. His patented method showcases the importance of precision in construction and mining operations.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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