Tokyo, Japan

Ryosuke Komatsu

This inventor holds 1 USPTO granted patent and 2 published patent applications. Top assignee: Tdk Corporation. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Ryosuke Komatsu. Retrieved from https://idiyas.com/inventor/ryosuke-komatsu-o8iq8otj

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 1 

Average Co-Inventor Count = 1.0


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Ryosuke Komatsu: Electronic Component Inventor.

Introduction

Ryosuke Komatsu is an inventor based in Tokyo, Japan, associated with TDK Corporation. His patent work concerns the design of an electronic component incorporating a resonator.

Latest Patents

Komatsu is named on 1 patent, titled “Electronic component.” The invention describes an element body formed from multiple laminated insulating layers, with a resonator positioned inside it. The resonator includes first and second conductors extending in the layers’ stacking direction, connected electrically by inductor conductors. At least one of the first and second conductors has an elongated shape when viewed along the stacking direction, while the direction in which the two conductors are arranged is perpendicular to that elongation.

Career Highlights

The available information identifies Komatsu’s work with TDK Corporation and his contribution to the electronic-component patent. The patent focuses on the structure and arrangement of conductors within a layered component.

Collaborations

Keigo Shibuya and Yuta Ashida are identified as Komatsu’s coworkers. The provided information does not specify their roles in the patent.

Conclusion

Ryosuke Komatsu’s documented invention addresses the arrangement of conductors and a resonator in a multilayer electronic component, reflecting his patent-related work with TDK Corporation.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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