Company Filing History:
Years Active: 2018
Title: Ryosuke Hiratsuka - Innovator in Micro-Vacancy Processing
Introduction
Ryosuke Hiratsuka is an inventor based in Sendai-shi, Japan. He has made significant contributions to the field of micro-vacancy processing. His innovative approach focuses on methods that enhance the etching and cleaning of narrow and deep micro vacancies.
Latest Patent Applications
Hiratsuka's notable patent application is titled "METHOD FOR TREATING INNER WALL SURFACE OF MICRO-VACANCY." This application presents a method for processing the inner wall surface of a micro vacancy, ensuring reliable etching and cleaning. The method is particularly effective even when the hole provided to the substrate is narrow and deep. The substrate features a surface for applying a processing solution and a micro vacancy with an opening on the surface. The aspect ratio of the micro vacancy is at least 5, or if it is less than 5, the ratio of the micro vacancy volume to the surface area of the opening is at least 3. The substrate is arranged in a processing space, which is then depressurized before introducing the processing solution to process the inner wall surface of the micro vacancy.
Conclusion
Ryosuke Hiratsuka's work in micro-vacancy processing showcases his innovative spirit and dedication to advancing technology in this specialized field. His contributions, particularly through his latest patent application, highlight the potential for improved processing methods in various applications.