This inventor holds 1 USPTO granted patent and 1 published patent application and 1 EPO patent. Top assignee: Toyobo Mc Corporation. Active years: 2023.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2023
Title: Ryo Sonoda - Innovator in Adhesive Technology
Introduction
Ryo Sonoda is a notable inventor based in Shiga, Japan. He has made significant contributions to the field of adhesive technology, particularly with his innovative approaches to adhesive compositions.
Latest Patents
Ryo Sonoda holds a patent for a low-dielectric adhesive composition. This invention aims to provide an adhesive that exhibits high adhesive properties not only to conventional polyimide and polyester films but also to metal substrates. The adhesive composition achieves high solder heat resistance and demonstrates excellent low-dielectric characteristics. The formulation includes an acid-modified polyolefin, an oligo-phenylene ether with a number-average molecular weight of 3000 or less, and an epoxy resin. This innovative composition meets specific requirements to enhance its performance.
Career Highlights
Ryo Sonoda is associated with Toyobo Mc Corporation, where he applies his expertise in adhesive technology. His work has contributed to advancements in materials that are essential for various industrial applications.
Collaborations
Ryo Sonoda has collaborated with notable colleagues, including Tadahiko Mikami and Tetsuo Kawakusu. Their combined efforts have fostered innovation in the adhesive sector.
Conclusion
Ryo Sonoda's contributions to adhesive technology, particularly through his patented low-dielectric adhesive composition, highlight his role as an innovator in the field. His work continues to influence advancements in materials science and engineering.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile