The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 22, 2023
Filed:
May. 17, 2019
Applicant:
Toyobo Co., Ltd., Osaka, JP;
Inventors:
Assignee:
TOYOBO MC CORPORATION, Osaka, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09J 11/06 (2006.01); C09J 7/30 (2018.01); C09J 11/08 (2006.01); C08L 63/00 (2006.01); C08L 79/08 (2006.01); C08K 5/06 (2006.01); H05K 1/03 (2006.01); B32B 15/09 (2006.01); B32B 15/12 (2006.01); B32B 15/20 (2006.01); B32B 27/10 (2006.01); B32B 15/18 (2006.01); C09J 123/26 (2006.01); H05K 1/02 (2006.01); H05K 1/05 (2006.01);
U.S. Cl.
CPC ...
C09J 123/26 (2013.01); C09J 11/06 (2013.01); H05K 1/028 (2013.01); H05K 1/056 (2013.01); H05K 2201/0154 (2013.01); H05K 2201/0355 (2013.01);
Abstract
The present invention aims to provide an adhesive composition which exhibits high adhesive property not only to the conventional polyimide and polyester film but also to a metal substrate, can achieve high solder heat resistance and exhibits excellent low-dielectric characteristics. According to the present invention, there is provided an adhesive composition containing an acid-modified polyolefin (a), an oligo-phenylene ether (b) having a number-average molecular weight of 3000 or less, and an epoxy resin (c), wherein the adhesive composition satisfies the following requirement(s) (A) and/or (B):