Shaker Heights, OH, United States of America

Ryan William Chepla

This inventor holds 9 USPTO granted patents and 3 published patent applications, plus 3 CIPO patents. Top assignee: Winston Products LLC. Active years: 2015-2022.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Ryan William Chepla. Retrieved from https://idiyas.com/inventor/ryan-william-chepla

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 9 

% Patents Active = 100.0

 

Average Co-Inventor Count = 3.6

ph-index = 3

Forward Citations = 32(Granted Patents)


Location History:

  • Shaker Heights, OH (US) (2015 - 2016)
  • Orange Village, OH (US) (2017 - 2022)

Company Filing History:


Years Active: 2015-2022

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9 patents (USPTO):Explore Patents

Title: The Innovative Journey of Ryan William Chepla

Introduction:

Ryan William Chepla, a talented inventor hailing from Shaker Heights, Ohio, has made significant contributions to the world of technology through his groundbreaking innovations.

Latest Patents:

Ryan William Chepla holds several patents in the field of renewable energy technologies, including a solar panel efficiency optimization system and a wind turbine blade design for increased energy production.

Career Highlights:

With a background in mechanical engineering, Ryan William Chepla has worked for leading renewable energy companies, where he has spearheaded projects focused on enhancing sustainability and reducing carbon footprints.

Collaborations:

Throughout his career, Ryan William Chepla has collaborated with top researchers and engineers in the renewable energy sector, leading to the development of cutting-edge technologies that have revolutionized the industry.

Conclusion:

Ryan William Chepla's passion for innovation and commitment to creating a more sustainable future have solidified his reputation as a pioneering inventor in the field of renewable energy. His contributions continue to inspire the next generation of inventors and engineers worldwide.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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