Company Filing History:
Years Active: 2023-2025
Title: The Innovative Contributions of Ryan Tordillo Comadre
Introduction
Ryan Tordillo Comadre is a notable inventor based in Melaka, Malaysia. He has made significant contributions to the field of semiconductor technology, holding 2 patents that showcase his innovative spirit and technical expertise.
Latest Patents
One of his latest patents is a semiconductor package with a blind hole attachment to a heat sink. This invention includes a lead frame that features a die pad and multiple leads, with a semiconductor die mounted on the die attach surface of the die pad. The encapsulant body, made of electrically insulating material, covers the semiconductor die and portions of the lead frame. A fastener receptacle with a blind hole is integrated into the encapsulant body or the die pad, allowing for efficient thermal management.
Another significant patent is the multi-layer interconnection ribbon. This semiconductor package assembly consists of a carrier with a die attach surface and a contact pad that is separated from the die attach surface. A semiconductor die is mounted on the die attach surface, featuring front side metallization that faces away from the die attach surface. An interconnect ribbon connects the semiconductor die to the contact pad, ensuring electrical connectivity. The encapsulant body encapsulates the semiconductor die and part of the interconnect ribbon, which includes a layer stack of different metals to enhance performance.
Career Highlights
Ryan Tordillo Comadre is currently employed at Infineon Technologies AG, a leading company in semiconductor solutions. His work focuses on developing advanced technologies that improve the efficiency and reliability of semiconductor packages.
Collaborations
Ryan has collaborated with talented coworkers such as Victor Dela Cruz Del Rosario and Bernie Tabanao Rosales. Their combined expertise contributes to the innovative projects at Infineon Technologies AG.
Conclusion
Ryan Tordillo Comadre's contributions to semiconductor technology through his patents and collaborative efforts highlight his role as an influential inventor in the industry. His work continues to pave the way for advancements in semiconductor packaging solutions.