The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 07, 2025
Filed:
Oct. 25, 2021
Applicant:
Infineon Technologies Ag, Neubiberg, DE;
Inventors:
Ryan Tordillo Comadre, Melaka, MY;
Victor Dela Cruz Del Rosario, Melaka, MY;
Bernie Tabanao Rosales, Melaka, MY;
Subaramaniym Senivasan, Jasin, MY;
Heng Chen Tang, Muar, MY;
Assignee:
Infineon Technologies AG, Neubiberg, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/40 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/4093 (2013.01); H01L 23/4006 (2013.01); H01L 2023/405 (2013.01); H01L 2023/4087 (2013.01); H01L 24/48 (2013.01); H01L 2224/48245 (2013.01);
Abstract
A semiconductor package includes a lead frame that includes a die pad and a plurality of leads, a semiconductor die mounted on a die attach surface of the die pad, an encapsulant body of electrically insulating material that covers semiconductor die and portions of the lead frame, and a fastener receptacle that includes a blind hole in the encapsulant body or the die pad, wherein a rear surface of the die pad is exposed from a first main face of the encapsulant body.