Somerville, MA, United States of America

Ryan Smith

This inventor holds 9 USPTO granted patents. Top assignee: Formlabs, Inc.. Active years: 2020-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Ryan Smith. Retrieved from https://idiyas.com/inventor/ryan-smith-00ccpgej

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 55.6

Average Co-Inventor Count = 3.1

ph-index = 2

Forward Citations = 15(Granted Patents)


Company Filing History:


Years Active: 2020-2026

Loading Chart...
9 patents (USPTO):Explore Patents

Title: The Innovative Journey of Ryan Smith

Introduction

Ryan Smith is a notable inventor based in Somerville, MA (US). He has made significant contributions to the field of three-dimensional printing, holding a total of 9 patents. His work has been instrumental in advancing the capabilities and applications of 3D printing technology.

Latest Patents

Among his latest innovations is a build platform designed specifically for three-dimensional printers. This invention showcases his commitment to enhancing the efficiency and effectiveness of 3D printing processes.

Career Highlights

Ryan Smith is currently employed at Formlabs, Inc., a company renowned for its cutting-edge 3D printing solutions. His role at Formlabs has allowed him to push the boundaries of what is possible in the realm of additive manufacturing.

Collaborations

Throughout his career, Ryan has collaborated with talented individuals such as Nate Jeffery and Yoav Reches. These partnerships have fostered a creative environment that encourages innovation and the development of groundbreaking technologies.

Conclusion

Ryan Smith's contributions to the field of 3D printing exemplify the spirit of innovation. His patents and collaborative efforts continue to shape the future of this exciting industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…