Enola, PA, United States of America

Ryan S Gelotte

This inventor holds 1 USPTO granted patent. Top assignee: Fci Americas Technology Inc.. Active years: 2010.


% Patents Active = 100.0

Average Co-Inventor Count = 4.0

ph-index = 1

Forward Citations = 9(Granted Patents)


Company Filing History:


Years Active: 2010

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1 patent (USPTO):Explore Patents

Title: The Innovative Contributions of Ryan S. Gelotte

Introduction

Ryan S. Gelotte, an accomplished inventor based in Enola, Pennsylvania, has made significant strides in the field of electrical engineering. His notable innovation is an overmolded electrical contact array, which enhances the functionality and reliability of electrical connectors used in various applications.

Latest Patents

Ryan holds one patent, which focuses on the design of a connector that incorporates an overmolded housing. This invention is engineered to control the position of the mounting ends of the connector and provide a robust structure for transferring forces during the press fit to the printed circuit board (PCB). The patent includes a first leadframe assembly with multiple contacts, a second leadframe assembly, an edge card, and a tail alignment housing. Each contact in the assembly has a lead portion engaging the edge card, ensuring a secure connection.

Career Highlights

Ryan is associated with Fci Americas Technology Inc., a company dedicated to advancing technology in the electrical connectivity sector. His work has been instrumental in developing solutions that address common challenges faced by the industry, particularly in improving the integration and performance of electronic components.

Collaborations

Throughout his career, Ryan has collaborated with talented colleagues such as Joseph Blair Shuey and Lewis Robin Johnson. These partnerships have contributed to the innovative environment at Fci Americas Technology Inc., fostering creativity and technological advancements in their projects.

Conclusion

In conclusion, Ryan S. Gelotte represents the spirit of innovation through his focused contributions in the field of electrical connectors. His patent for the overmolded electrical contact array illustrates his commitment to enhancing the functionality of electronic components, showcasing how individual inventors can drive progress in technology. Ryan's ongoing work at Fci Americas Technology Inc. positions him as a key player in shaping the future of electrical engineering.

Profile summary based on public USPTO records.
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